- Tytuł:
- Stress evolution mechanism and thermo-mechanical reliability analysis of copper-filled TSV interposer
- Autorzy:
-
Chen, Yuan
Su, Wei
Huang, Hong-Zhong
Lai, Ping
Lin, Xiao-ling
Chen, Si - Tematy:
-
through silicon vias
thermo-mechanical reliability
failure mechanism
finite element analysis
3D integrated packaging
thermal cycling experiment - Pokaż więcej
- Dostawca treści:
- BazTech
Artykuł